• High-Frequency Connector Substrate Material Electronics Design Impedance Prototype RF Power Amplifier PCB
  • High-Frequency Connector Substrate Material Electronics Design Impedance Prototype RF Power Amplifier PCB
  • High-Frequency Connector Substrate Material Electronics Design Impedance Prototype RF Power Amplifier PCB
  • High-Frequency Connector Substrate Material Electronics Design Impedance Prototype RF Power Amplifier PCB
  • High-Frequency Connector Substrate Material Electronics Design Impedance Prototype RF Power Amplifier PCB
  • High-Frequency Connector Substrate Material Electronics Design Impedance Prototype RF Power Amplifier PCB

High-Frequency Connector Substrate Material Electronics Design Impedance Prototype RF Power Amplifier PCB

Type: Rigid Circuit Board
Dielectric: FR-4
Material: Fiberglass Epoxy
Samples:
US$ 20/Piece 1 Piece(Min.Order)
| Order Sample
Anti-static package with high quality carton box
Customization:
Shipping Cost:

Estimated freight per unit.

about shipping cost and estimated delivery time.
Payment Method: visa mastercard discover JCB diners club american express T/T
  Initial Payment Full Payment
Currency: US$
Return&refunds: You can apply for a refund up to 30 days after receipt of the products.
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High-Frequency Connector Substrate Material Electronics Design Impedance Prototype RF Power Amplifier PCB pictures & photos
High-Frequency Connector Substrate Material Electronics Design Impedance Prototype RF Power Amplifier PCB
US $2-5 / Piece
Min. Order: 1 Piece

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Basic Info.

Model NO.
RF Power Amplifier PCB
Application
Consumer Electronics
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Electrolytic Foil
Base Material
Copper
Insulation Materials
Organic Resin
Brand
Finestpcb
Service
One-Step PCB Service
Solder Mask Color
Blue.Green.Red.Black.White
Layer
1-40layers
Min BGA Ball Pitch
0.4mm
Surface Finishing
HASL\OSP\Immersion Gold
HASL\OSP\Immersion Gold
Fr4/Rogers/Aluminum/High Tg
Copper Thickness
0.5-5oz
Board Thickness
1.6 ±0.1mm
Minimum Hole
Minimum
Minimum Width
3/3mil
Minimum Line
3/3mil
Product Name
OEM PCB PCBA Board Assembly
Transport Package
Vacuum Package for Bare PCB and ESD Package
Specification
customized
Trademark
finest
Origin
China
HS Code
8534001000
Production Capacity
30000 Pieces

Packaging & Delivery

Package Size
10.00cm * 10.00cm * 5.00cm
Package Gross Weight
1.000kg
Lead Time
10 days (1 - 10 Pieces)
To be negotiated ( > 10 Pieces)

Product Description

Product Title: Amplify Performance with Our RF Power Amplifier PCB

Elevate your signal strength and boost connectivity with our RF Power Amplifier PCB, meticulously crafted to deliver unparalleled performance in the world of wireless communication.

Product Benefits:

Powerful Signal Amplification: Experience a significant boost in signal strength, ensuring robust and reliable communication.
Enhanced Transmission Range: Extend the reach of your signals, connecting devices seamlessly over extended distances.
Optimized Power Efficiency: Achieve more with less power consumption, contributing to prolonged device battery life.
Product Features:

Product Specifications:
Premium FR-4 Material: Engineered for durability and resilience.
Frequency Optimization: Tailored for frequencies ranging from 1MHz to 6GHz.
Impedance Stability: Maintains a steadfast 50 Ohms for consistent performance.
Multilayer Design: Incorporates 4 layers for superior signal processing capabilities.
Key Features:
Gold-Plated Contacts: Ensures corrosion resistance for enduring reliability.
Compact Form Factor: Ideal for applications with limited space.
RoHS Compliant: Aligns with environmental standards for responsible manufacturing.
Upgrade your devices with the strength of our RF Power Amplifier PCB, where cutting-edge technology converges with the demand for superior wireless performance. Trust in amplified signals and enhanced connectivity for a seamless communication experience.




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High-Frequency Connector Substrate Material Electronics Design Impedance Prototype RF Power Amplifier PCB

High-Frequency Connector Substrate Material Electronics Design Impedance Prototype RF Power Amplifier PCB

 
High-Frequency Connector Substrate Material Electronics Design Impedance Prototype RF Power Amplifier PCB
High-Frequency Connector Substrate Material Electronics Design Impedance Prototype RF Power Amplifier PCB
 
High-Frequency Connector Substrate Material Electronics Design Impedance Prototype RF Power Amplifier PCB
High-Frequency Connector Substrate Material Electronics Design Impedance Prototype RF Power Amplifier PCB

High-Frequency Connector Substrate Material Electronics Design Impedance Prototype RF Power Amplifier PCB
High-Frequency Connector Substrate Material Electronics Design Impedance Prototype RF Power Amplifier PCB
High-Frequency Connector Substrate Material Electronics Design Impedance Prototype RF Power Amplifier PCB


Why choose Finest PCB Assembly?
1. More than 19 years experience of in electronic manufacturing services for PCB making.
2. One-stop service | PCB Manufacturing | Components sourcing and PCB assembly one-stop PCBA service to help you easily achieve your electronic products.
3. More than 1000 customers working with us for telecom, IOT, RF, smart control, security, medical, industrial, automotive, 3G / 4G / 5G products.
4. Reasonable and stable price: have established a strong global electronics components supply chain that helps us get
reasonable and stable price
5. Quality assurance: more than 15 years of experience in the engineering team and quality control team to ensure
all products come out under control.
6. Professional replace-solution: help customers source professional replace-solution to achieve faster, lower cost with high-quality components purchasing agent service.

 
PCBA Technical Capability
 
1. Assembly Type::
FR4, FPC, Rigid-flex PCB, Metal base PCB.
2. Assembly Specification:
Min size L50*W50mm; Max size: L510*460mm
3. Assembly thickness:
Min thickness: 0.2mm; Max thickness: 3.0mm
4. Components Specification
 
Components DIP:
01005Chip/0.35 Pitch BGA
Minimum device accuracy:
+/-0.04mm
Minimum footprint distance:
0.3mm
5. File format:
BOM list; PCB Gerber file:
6. Test
 
IQC:
Incoming inspection
IPQC:
Production inspection; first ICR test
Visual QC:
Regularly quality inspection
SPI test :
Automatic solder paste optical inspection
AOI:
SMD component welding detection, components shortage & component polarity detection
X-Ravd:
BGA test; QFN and other precision devices hidden PAD device inspection
Function test:
Test function and performance according to the customer's test procedures and steps
7. Reworking:
BGA rework equipment
8. Delivery Time
 
Normal delivery time:
24 hours( fastest 12 hours quick-turn)
Small production:
72 hours( fastest 24 hours quick-turn)
Medium production:
5 working days.
9. Capacity:
SMT assembly 5 million points/day; plug-in & welding 300,000 points/day; 50-100 items/day
10. Components Service
 
A full set of substitute materials:
Have experience in component procurement sourcing, and management systems, and provide cost-effective services for OEM projects
Only SMT:
Do SMT and backhand welding according to components PCB boards provided by customers.
Components purchasing:
Customers provide core components, and we provide component sourcing services.
PCB Specification:
PCB layers:
1-24layers
PCB materials:
CEM1, CEM3, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free
PCB max. board size:
620*1100mm (Custom)
PCB certificate:
RoHS Directive-Compliant
PCB Thickness:
1.6 ±0.1mm
Layer Copper Thickness:
0.5-5oz
Inner Layer Copper Thickness:
0.5-4oz
PCB max. board thickness:
6.0mm
Minimum Hole Size:
0.20mm
Minimum Line Width/Space:
3/3mil
Min. S/M Pitch:
0.1mm(4mil)
Plate Thickness and Aperture Ratio :
30:1
Minimum Hole Copper:
20µm
Hole Dia. Tolerance(PTH):
±0.075mm(3mil)
Hole dia. Tolerance(NPTH):
±0.05mm (2mil)
Hole Position Deviation:
±0.05mm (2mil)
Outline Tolerance:
±0.05mm (2mil)
PCB solder mask:
Black, white, yellow
PCB surface finished:
HASL Lead-free, Immersion ENIG, Chem Tin, Flash Gold, OSP, Gold finger, Peelable, Immersion Silver
Legend:
White
E-test:
100% AOI, X-ray, Flying probe test.
Outline:
Rout and Score/V-cut
Inspection Standard:
IPC-A-610CCLASSII
Certificates:
UL (E503048),ISO9001/ISO14001/IATF16949
Outgoing Reports:
Final Inspection, E-test, Solderability Test, Micro Section, and More


FAQ
1. who are we?
We are based in Guangdong, China, and start from 2019, sell to Domestic Market(50.00%), North America(15.00%), South
America(12.00%),Northern Europe(12.00%),Western Europe(5.00%),Southeast Asia(2.00%),Mid East(2.00%),Eastern Europe(2.00%). There
are a total of about 301-500 people in our office.

2. how can we guarantee quality?
Always a pre-production sample before mass production;
Always final Inspection before shipment;

3. what can you buy from us?
PCBA, PCB Assembly, PCBA Board, LED PCBA, Electronic PCBA

4. why should you buy from us not from other suppliers?
*A 18-year one-stop solution provider *Strong R&D group with 30 engineers *Monthly output:45000 sqm of PCBs and PCBAs*4500-square-meter factory *Eight SMT production-line *Automatic SMT, Reflow machine, AOI&x-RAY *Fast response, reply within 24hrs

5. what services can we provide?
Accepted Delivery Terms: FOB, CIF, EXW, Express Delivery;
Accepted Payment Currency: USD, EUR, GBP;
Accepted Payment Type: T/T, L/C, MoneyGram, Western Union;
Language Spoken: English, French


 

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From payment to delivery, we protect your trading.
High-Frequency Connector Substrate Material Electronics Design Impedance Prototype RF Power Amplifier PCB pictures & photos
High-Frequency Connector Substrate Material Electronics Design Impedance Prototype RF Power Amplifier PCB
US $2-5 / Piece
Min. Order: 1 Piece

360° Virtual Tour

Diamond Member Since 2023

Suppliers with verified business licenses

Secured Trading Service
Manufacturer/Factory & Trading Company
Number of Employees
45
Year of Establishment
2003-04-03