Customization: | Available |
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Structure: | Single-Sided FPC |
Material: | Polyimide |
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PCBA Technical Capability
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1. Assembly Type::
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FR4, FPC, Rigid-flex PCB, Metal base PCB.
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2. Assembly Specification:
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Min size L50*W50mm; Max size: L510*460mm
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3. Assembly thickness:
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Min thickness: 0.2mm; Max thickness: 3.0mm
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4. Components Specification
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Components DIP:
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01005Chip/0.35 Pitch BGA
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Minimum device accuracy:
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+/-0.04mm
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Minimum footprint distance:
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0.3mm
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5. File format:
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BOM list; PCB Gerber file:
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6. Test
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IQC:
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Incoming inspection
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IPQC:
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Production inspection; first ICR test
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Visual QC:
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Regularly quality inspection
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SPI test :
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Automatic solder paste optical inspection
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AOI:
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SMD component welding detection, components shortage & component polarity detection
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X-Ravd:
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BGA test; QFN and other precision devices hidden PAD device inspection
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Function test:
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Test function and performance according to the customer's test procedures and steps
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7. Reworking:
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BGA rework equipment
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8. Delivery Time
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Normal delivery time:
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24 hours( fastest 12 hours quick-turn)
|
Small production:
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72 hours( fastest 24 hours quick-turn)
|
Medium production:
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5 working days.
|
9. Capacity:
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SMT assembly 5 million points/day; plug-in & welding 300,000 points/day; 50-100 items/day
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10. Components Service
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|
A full set of substitute materials:
|
Have experience in component procurement sourcing, and management system, and provide cost-effective services for OEM projects
|
Only SMT:
|
Do SMT and backhand welding according to components PCB boards provided by customers.
|
Components purchasing:
|
Customers provide core components, and we provide component sourcing services.
|
PCBA Technical Capability
|
|
1. Assembly Type::
|
FR4, FPC, Rigid-flex PCB, Metal base PCB.
|
2. Assembly Specification:
|
Min size L50*W50mm; Max size: L510*460mm
|
3. Assembly thickness:
|
Min thickness: 0.2mm; Max thickness: 3.0mm
|
4. Components Specification
|
|
Components DIP:
|
01005Chip/0.35 Pitch BGA
|
Minimum device accuracy:
|
+/-0.04mm
|
Minimum footprint distance:
|
0.3mm
|
5. File format:
|
BOM list; PCB Gerber file:
|
6. Test
|
|
IQC:
|
Incoming inspection
|
IPQC:
|
Production inspection; first ICR test
|
Visual QC:
|
Regularly quality inspection
|
SPI test :
|
Automatic solder paste optical inspection
|
AOI:
|
SMD component welding detection, components shortage & component polarity detection
|
X-Ravd:
|
BGA test; QFN and other precision devices hidden PAD device inspection
|
Function test:
|
Test function and performance according to the customer's test procedures and steps
|
7. Reworking:
|
BGA rework equipment
|
8. Delivery Time
|
|
Normal delivery time:
|
24 hours( fastest 12 hours quick-turn)
|
Small production:
|
72 hours( fastest 24 hours quick-turn)
|
Medium production:
|
5 working days.
|
9. Capacity:
|
SMT assembly 5 million points/day; plug-in & welding 300,000 points/day; 50-100 items/day
|
10. Components Service
|
|
A full set of substitute materials:
|
Have experience in component procurement sourcing, and management systems, and provide cost-effective services for OEM projects
|
Only SMT:
|
Do SMT and backhand welding according to components PCB boards provided by customers.
|
Components purchasing:
|
Customers provide core components, and we provide component sourcing services.
|