Customization: | Available |
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Type: | Rigid Circuit Board |
Dielectric: | FR-4 |
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At Finest Printed Circuit Board Limited, we specialize in providing high-quality Android mobile PCB boards and Custom Speaker Amplifier SMT PCBA solutions tailored to meet the unique requirements of the electronics manufacturing industry. Our focus is on delivering precision, durability, and design flexibility, enabling manufacturers to overcome common challenges in product development and gain a competitive edge in the market. Let us help you streamline your production process and achieve high-performance results.
Optimized for Compact Mobile Designs
When it comes to designing PCBs for Android mobile devices, space and efficiency are critical. Our PCBs are optimized for the compact yet powerful designs of today's smartphones, ensuring that every component is efficiently placed and connected. With precise layer stacking and minimal signal interference, we ensure that your mobile devices maintain smooth functionality and connectivity, even in the most compact designs.
Advanced Circuit Integration for Speed and Stability
Speed and stability are non-negotiable for mobile PCBs, and our designs ensure just that. Using advanced fabrication processes, we incorporate the latest technologies like high-speed transmission and reduced electromagnetic interference (EMI) to support fast data processing and uninterrupted user experience. Our boards are engineered to meet the power requirements of Android devices while providing stable performance over extended periods of use.
Tailored Sound Amplification Solutions
Achieving high-quality audio output is a common challenge for electronics manufacturers developing speaker systems. Our custom speaker amplifier SMT PCBA solutions are meticulously crafted to enhance audio clarity and reduce distortion. Whether you are working on home audio systems or portable Bluetooth speakers, we customize our assemblies to match your specifications, providing an ideal balance of power, size, and sound quality.
Precision Assembly for Reliable Audio Performance
With a focus on precision in every component placement, we ensure that our speaker amplifier PCBA solutions deliver consistent and reliable audio performance. By leveraging SMT technology, we can place components such as capacitors, inductors, and resistors with extreme accuracy, ensuring that the signal path is clear and that your amplifier can handle high and low frequencies with equal efficiency. This precision directly translates to high-quality sound for end-users.
Efficient Power Distribution
Power management is a key consideration in both Android mobile PCBs and speaker amplifier assemblies. Our PCBs are designed to distribute power efficiently, ensuring that each component receives the exact power it needs without excessive consumption. This results in longer battery life for mobile devices and optimal power use for amplifier systems, making your products more energy-efficient and reliable.
Advanced Heat Dissipation Techniques
Heat buildup can significantly affect the performance and longevity of electronic components. To mitigate this, we integrate advanced heat dissipation techniques into our PCBA designs. Using thermal vias and optimized copper traces, we ensure that heat is evenly distributed across the board, preventing hot spots and reducing the risk of component damage. This is particularly important for speaker amplifiers and mobile devices, where continuous use can generate significant heat.
High-Speed SMT Prototyping for Quick Turnarounds
Time is of the essence in electronics manufacturing, and our high-speed SMT prototyping services help you get your products to market faster. With our efficient production processes, we can produce prototypes quickly without compromising on quality, allowing you to test your designs and make adjustments before scaling up to full production. This rapid prototyping capability ensures that you can bring innovative products to market swiftly and stay ahead of the competition.
Flexible Production Capabilities
From initial design concepts to large-scale production, our flexible manufacturing processes can adapt to your needs. We offer scalable solutions that allow you to adjust production volumes based on market demand, helping you manage costs and inventory more effectively. Our streamlined processes ensure that you receive consistent quality across every unit, regardless of production scale.
High-Standard Sourcing for Component Reliability
We prioritize sourcing components from reputable suppliers to ensure the reliability and performance of every PCBA we produce. Our materials meet industry standards, ensuring compatibility with various electronic devices and environments. This attention to quality helps us deliver PCBAs that stand up to rigorous testing and usage, providing peace of mind to manufacturers and end-users alike.
Compliance with Global Standards
Quality and safety are paramount, especially when producing PCBs for consumer electronics like Android mobiles and audio devices. Our manufacturing processes comply with international standards such as RoHS, ISO, and IPC, ensuring that every board we deliver meets the required quality benchmarks. This compliance guarantees that your products are ready for global markets, facilitating smoother regulatory approvals and broader market reach.
Expert Design Support
Navigating the complexities of circuit board design can be challenging. Our team of engineers is available to provide expert support throughout your project, from initial design to final production. We work closely with you to ensure that every design meets your technical specifications and performance requirements, enabling a seamless transition from concept to finished product.
Commitment to Customer Satisfaction
At Finest Printed Circuit Board Limited, customer satisfaction is at the core of everything we do. We are dedicated to building long-term partnerships by delivering consistent quality, on-time delivery, and responsive service. Our goal is to make your experience as smooth as possible, so you can focus on what you do best-bringing innovative electronics to market.
Are you ready to take the next step in optimizing your Android mobile devices or speaker amplifier products? Finest Printed Circuit Board Limited is here to provide the high-quality, reliable PCBA solutions you need. Reach out to us today to request a quote and learn how we can support your electronics manufacturing needs. Let's bring your innovative ideas to life together.
PCBA Technical Capability
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1. Assembly Type::
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FR4, FPC, Rigid-flex PCB, Metal base PCB.
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2. Assembly Specification:
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Min size L50*W50mm; Max size: L510*460mm
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3. Assembly thickness:
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Min thickness: 0.2mm; Max thickness: 3.0mm
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4. Components Specification
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Components DIP:
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01005Chip/0.35 Pitch BGA
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Minimum device accuracy:
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+/-0.04mm
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Minimum footprint distance:
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0.3mm
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5. File format:
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BOM list; PCB Gerber file:
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6. Test
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IQC:
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Incoming inspection
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IPQC:
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Production inspection; first ICR test
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Visual QC:
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Regularly quality inspection
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SPI test :
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Automatic solder paste optical inspection
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AOI:
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SMD component welding detection, components shortage & component polarity detection
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X-Ravd:
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BGA test; QFN and other precision devices hidden PAD device inspection
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Function test:
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Test function and performance according to the customer's test procedures and steps
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7. Reworking:
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BGA rework equipment
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8. Delivery Time
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Normal delivery time:
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24 hours( fastest 12 hours quick-turn)
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Small production:
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72 hours( fastest 24 hours quick-turn)
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Medium production:
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5 working days.
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9. Capacity:
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SMT assembly 5 million points/day; plug-in & welding 300,000 points/day; 50-100 items/day
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10. Components Service
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A full set of substitute materials:
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Have experience in component procurement sourcing, and management systems, and provide cost-effective services for OEM projects
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Only SMT:
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Do SMT and backhand welding according to components PCB boards provided by customers.
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Components purchasing:
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Customers provide core components, and we provide component sourcing services.
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PCB Specification:
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PCB layers:
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1-24layers
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PCB materials:
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CEM1, CEM3, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free
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PCB max. board size:
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620*1100mm (Custom)
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PCB certificate:
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RoHS Directive-Compliant
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PCB Thickness:
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1.6 ±0.1mm
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Layer Copper Thickness:
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0.5-5oz
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Inner Layer Copper Thickness:
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0.5-4oz
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PCB max. board thickness:
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6.0mm
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Minimum Hole Size:
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0.20mm
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Minimum Line Width/Space:
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3/3mil
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Min. S/M Pitch:
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0.1mm(4mil)
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Plate Thickness and Aperture Ratio :
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30:1
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Minimum Hole Copper:
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20µm
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Hole Dia. Tolerance(PTH):
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±0.075mm(3mil)
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Hole dia. Tolerance(NPTH):
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±0.05mm (2mil)
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Hole Position Deviation:
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±0.05mm (2mil)
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Outline Tolerance:
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±0.05mm (2mil)
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PCB solder mask:
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Black, white, yellow
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PCB surface finished:
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HASL Lead-free, Immersion ENIG, Chem Tin, Flash Gold, OSP, Gold finger, Peelable, Immersion Silver
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Legend:
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White
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E-test:
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100% AOI, X-ray, Flying probe test.
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Outline:
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Rout and Score/V-cut
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Inspection Standard:
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IPC-A-610CCLASSII
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Certificates:
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UL (E503048),ISO9001/ISO14001/IATF16949
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Outgoing Reports:
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Final Inspection, E-test, Solderability Test, Micro Section, and More
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