| Customization: | Available |
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| Type: | Rigid Circuit Board |
| Dielectric: | FR-4 |
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Finest Printed Circuit Board Limited specializes in delivering high-performance OEM rigid circuit boards for consumer electronics, including mobile phone motherboards and multilayer DC converter PCBs. Our expertise in PCB and PCBA manufacturing allows us to address the most pressing challenges manufacturers face, providing efficient solutions that enhance product quality and reliability. We aim to help our clients overcome design complexities, ensuring a seamless integration of technology while maximizing performance.
Compact Design with High-Density Circuitry
Mobile phone motherboards require complex, multilayer PCB designs to support a wide range of functions, including processing, memory, and connectivity. At Finest Printed Circuit Board Limited, we offer high-density multilayer boards that optimize space without sacrificing performance. Our PCBs support compact integration of components such as microprocessors, GPUs, memory modules, and RF components, allowing you to develop smaller, more powerful mobile devices.
Improved Thermal Management
Heat dissipation is a critical issue in mobile devices where multiple components operate in close proximity. We incorporate thermal vias and copper pours into our multilayer designs to efficiently manage heat. This prevents overheating, ensuring optimal device performance and extending product lifespan, even under high-stress conditions.
Durability for Frequent Usage
Mobile devices endure frequent handling, drops, and temperature fluctuations. Our rigid circuit boards are built with high-quality FR4 materials, ensuring mechanical stability and shock resistance. This robust design reduces failure rates and maintenance costs, offering better durability for end users.
Maximizing Power Efficiency
DC converters are essential for managing voltage and power in consumer electronics, especially in mobile applications where energy efficiency is critical. Our multilayer DC converter PCBs are designed to minimize energy loss and maximize power conversion efficiency. This helps manufacturers create products that consume less power while delivering high performance, making them ideal for portable electronics, renewable energy systems, and more.
Multilayer Structure for Complex Power Designs
DC converters require complex designs to manage multiple voltage levels. We offer multilayer PCB options that accommodate various power stages and configurations, ensuring smooth and efficient power flow. Whether it's step-up or step-down converters, our PCBs can handle your design needs with precision and reliability.
Safe and Reliable Operation
Ensuring operational safety in power management circuits is paramount. Our DC converter PCBs come with advanced features like short-circuit protection, overvoltage protection, and temperature monitoring. These features safeguard both the PCB and the connected components, preventing damage caused by electrical faults.
Managing Space and Complexity
As electronics get smaller, the need for compact, multilayer PCB designs grows. Manufacturers often struggle to incorporate complex circuits within limited space without compromising functionality. We solve this problem by delivering high-layer count PCBs with efficient layout designs, reducing overall board size while maintaining full functionality.
Reducing Signal Interference
In mobile phones and power converters, electromagnetic interference (EMI) can degrade signal quality and efficiency. Our PCBs are designed with EMI-reduction techniques, including shielded ground layers and optimal trace routing, to ensure minimal interference and higher signal integrity.
Cost-Effective Solutions
At Finest Printed Circuit Board Limited, we understand that cost is a significant factor. Our production process is optimized to deliver high-quality multilayer PCBs at competitive prices, making it easier for clients to balance cost-efficiency with high performance. With our ability to scale production based on demand, we ensure flexible, on-time delivery that meets your production schedule.
Superior Engineering Expertise
Our team of experienced engineers is dedicated to providing tailored PCB solutions that meet your unique design requirements. From mobile phone motherboard PCBs to complex DC converter circuits, we have the knowledge and tools to help you overcome any design challenge.
Strict Quality Control
We prioritize quality at every stage of production. All of our PCBs go through rigorous testing to meet industry standards such as RoHS compliance. This ensures that every board you receive performs reliably in even the most demanding applications.
Fast Lead Times and Global Delivery
We understand the importance of time-to-market. That's why we offer fast turnaround times for both prototype and mass production orders. Our logistics team ensures timely global delivery, so you can meet your production deadlines without delays.
Finest Printed Circuit Board Limited is ready to assist you with your next mobile phone motherboard or DC converter PCB project. Get in touch today to request a custom quote and see how our high-quality, multilayer PCBs can elevate your product performance. Whether you're dealing with complex power management systems or compact consumer electronics, we're here to help streamline your production process with reliable, efficient PCB solutions.
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PCBA Technical Capability
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1. Assembly Type::
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FR4, FPC, Rigid-flex PCB, Metal base PCB.
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2. Assembly Specification:
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Min size L50*W50mm; Max size: L510*460mm
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3. Assembly thickness:
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Min thickness: 0.2mm; Max thickness: 3.0mm
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4. Components Specification
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Components DIP:
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01005Chip/0.35 Pitch BGA
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Minimum device accuracy:
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+/-0.04mm
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Minimum footprint distance:
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0.3mm
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5. File format:
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BOM list; PCB Gerber file:
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6. Test
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IQC:
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Incoming inspection
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IPQC:
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Production inspection; first ICR test
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Visual QC:
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Regularly quality inspection
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SPI test :
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Automatic solder paste optical inspection
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AOI:
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SMD component welding detection, components shortage & component polarity detection
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X-Ravd:
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BGA test; QFN and other precision devices hidden PAD device inspection
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Function test:
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Test function and performance according to the customer's test procedures and steps
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7. Reworking:
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BGA rework equipment
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8. Delivery Time
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Normal delivery time:
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24 hours( fastest 12 hours quick-turn)
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Small production:
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72 hours( fastest 24 hours quick-turn)
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Medium production:
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5 working days.
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9. Capacity:
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SMT assembly 5 million points/day; plug-in & welding 300,000 points/day; 50-100 items/day
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10. Components Service
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A full set of substitute materials:
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Have experience in component procurement sourcing, and management systems, and provide cost-effective services for OEM projects
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Only SMT:
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Do SMT and backhand welding according to components PCB boards provided by customers.
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Components purchasing:
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Customers provide core components, and we provide component sourcing services.
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PCB Specification:
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PCB layers:
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1-24layers
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PCB materials:
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CEM1, CEM3, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free
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PCB max. board size:
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620*1100mm (Custom)
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PCB certificate:
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RoHS Directive-Compliant
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PCB Thickness:
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1.6 ±0.1mm
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Layer Copper Thickness:
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0.5-5oz
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Inner Layer Copper Thickness:
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0.5-4oz
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PCB max. board thickness:
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6.0mm
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Minimum Hole Size:
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0.20mm
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Minimum Line Width/Space:
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3/3mil
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Min. S/M Pitch:
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0.1mm(4mil)
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Plate Thickness and Aperture Ratio :
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30:1
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Minimum Hole Copper:
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20µm
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Hole Dia. Tolerance(PTH):
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±0.075mm(3mil)
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Hole dia. Tolerance(NPTH):
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±0.05mm (2mil)
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Hole Position Deviation:
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±0.05mm (2mil)
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Outline Tolerance:
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±0.05mm (2mil)
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PCB solder mask:
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Black, white, yellow
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PCB surface finished:
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HASL Lead-free, Immersion ENIG, Chem Tin, Flash Gold, OSP, Gold finger, Peelable, Immersion Silver
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Legend:
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White
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E-test:
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100% AOI, X-ray, Flying probe test.
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Outline:
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Rout and Score/V-cut
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Inspection Standard:
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IPC-A-610CCLASSII
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Certificates:
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UL (E503048),ISO9001/ISO14001/IATF16949
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Outgoing Reports:
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Final Inspection, E-test, Solderability Test, Micro Section, and More
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