| Customization: | Available |
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| Type: | Rigid Circuit Board |
| Dielectric: | FR-4 |
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Unmatched Expertise in HDI High-Frequency PCBA Solutions
At Finest Printed Circuit Board Limited, we specialize in delivering cutting-edge PCB and PCBA solutions tailored to the intricate demands of modern electronics. Our expertise in HDI (High-Density Interconnect) high-frequency impedance controlled BGA (Ball Grid Array) PCBs is ideal for powering compact electronic devices, advanced power supplies, and high-performance gaming systems. We understand the critical challenges faced by our clients and provide seamless solutions that ensure superior performance, reliability, and efficiency.
High-Density Interconnect (HDI) Technology
HDI technology is essential for compact electronic devices requiring complex circuitry within limited space. Our HDI PCBs provide unmatched performance and reliability, making them ideal for modern smart devices and high-frequency applications.
High-Frequency Impedance Control
Maintaining signal integrity at high frequencies is crucial for the reliable operation of modern electronic devices. Our PCBs are designed with precise impedance control to ensure optimal performance.
BGA Technology for Reliable Connections
Ball Grid Array (BGA) technology is essential for achieving reliable connections in high-density PCBs. Our expertise in BGA technology ensures robust and durable PCBs for your electronic devices.
Tailored Solutions for Smart Electronic Devices
Smart electronic devices require advanced PCBs that can support their complex functionalities and compact designs. Our tailored PCBA solutions are designed to meet the specific needs of smart devices.
Advanced Power Supply Solutions
Power supplies are critical for the reliable operation of electronic devices. Our PCBA solutions for power supplies are engineered to provide superior performance and efficiency.
High-Performance Gaming PCBA
Gaming systems demand high-performance PCBs to support their advanced functionalities and deliver a seamless user experience. Our PCBA solutions for gaming devices are tailored to meet these exacting standards.
Addressing Key Challenges with Precision
We understand that each project comes with its own set of challenges. Our approach is centered around addressing your specific pain points with customized solutions.
State-of-the-Art Manufacturing and Quality Assurance
Quality and precision are at the core of our manufacturing philosophy. We utilize state-of-the-art equipment and stringent quality control measures to ensure that every PCB we produce meets the highest standards.
Contact Us for Your PCB Needs
If you are looking for a reliable partner for HDI high-frequency impedance controlled BGA PCBA for smart compact electronic devices, power supplies, and gaming systems, look no further than Finest Printed Circuit Board Limited. Our tailored solutions are designed to solve your pain points and deliver high-quality, efficient results. Contact us today to request a quote and discover how our expertise can help bring your projects to life.
Trust Finest Printed Circuit Board Limited to be your partner in innovation, delivering excellence and reliability in PCB manufacturing.
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PCBA Technical Capability
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1. Assembly Type::
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FR4, FPC, Rigid-flex PCB, Metal base PCB.
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2. Assembly Specification:
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Min size L50*W50mm; Max size: L510*460mm
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3. Assembly thickness:
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Min thickness: 0.2mm; Max thickness: 3.0mm
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4. Components Specification
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Components DIP:
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01005Chip/0.35 Pitch BGA
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Minimum device accuracy:
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+/-0.04mm
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Minimum footprint distance:
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0.3mm
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5. File format:
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BOM list; PCB Gerber file:
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6. Test
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IQC:
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Incoming inspection
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IPQC:
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Production inspection; first ICR test
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Visual QC:
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Regularly quality inspection
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SPI test :
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Automatic solder paste optical inspection
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AOI:
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SMD component welding detection, components shortage & component polarity detection
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X-Ravd:
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BGA test; QFN and other precision devices hidden PAD device inspection
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Function test:
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Test function and performance according to the customer's test procedures and steps
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7. Reworking:
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BGA rework equipment
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8. Delivery Time
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Normal delivery time:
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24 hours( fastest 12 hours quick-turn)
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Small production:
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72 hours( fastest 24 hours quick-turn)
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Medium production:
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5 working days.
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9. Capacity:
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SMT assembly 5 million points/day; plug-in & welding 300,000 points/day; 50-100 items/day
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10. Components Service
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A full set of substitute materials:
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Have experience in component procurement sourcing, and management systems, and provide cost-effective services for OEM projects
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Only SMT:
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Do SMT and backhand welding according to components PCB boards provided by customers.
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Components purchasing:
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Customers provide core components, and we provide component sourcing services.
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PCB Specification:
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PCB layers:
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1-24layers
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PCB materials:
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CEM1, CEM3, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free
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PCB max. board size:
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620*1100mm (Custom)
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PCB certificate:
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RoHS Directive-Compliant
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PCB Thickness:
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1.6 ±0.1mm
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Layer Copper Thickness:
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0.5-5oz
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Inner Layer Copper Thickness:
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0.5-4oz
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PCB max. board thickness:
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6.0mm
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Minimum Hole Size:
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0.20mm
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Minimum Line Width/Space:
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3/3mil
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Min. S/M Pitch:
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0.1mm(4mil)
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Plate Thickness and Aperture Ratio :
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30:1
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Minimum Hole Copper:
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20µm
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Hole Dia. Tolerance(PTH):
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±0.075mm(3mil)
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Hole dia. Tolerance(NPTH):
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±0.05mm (2mil)
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Hole Position Deviation:
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±0.05mm (2mil)
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Outline Tolerance:
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±0.05mm (2mil)
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PCB solder mask:
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Black, white, yellow
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PCB surface finished:
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HASL Lead-free, Immersion ENIG, Chem Tin, Flash Gold, OSP, Gold finger, Peelable, Immersion Silver
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Legend:
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White
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E-test:
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100% AOI, X-ray, Flying probe test.
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Outline:
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Rout and Score/V-cut
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Inspection Standard:
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IPC-A-610CCLASSII
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Certificates:
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UL (E503048),ISO9001/ISO14001/IATF16949
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Outgoing Reports:
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Final Inspection, E-test, Solderability Test, Micro Section, and More
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