| Customization: | Available |
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| Type: | Rigid Circuit Board |
| Dielectric: | FR-4 |
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Power supplies are the workhorses of electronics, silently converting raw power into the lifeblood that keeps our devices humming. But with great power comes great responsibility, especially when it comes to heat. Unmanaged heat can wreak havoc on power supply PCBs, shortening lifespans, compromising performance, and even sparking safety concerns.
Enter the art of thermal management: a strategic approach to mitigating heat buildup and ensuring optimal operating temperatures for your power supply PCB.
Why Thermal Management Matters:
Power conversion processes inherently generate heat. In power supply PCBs, this heat comes from:
Left unchecked, this heat can lead to:
Taming the Thermal Beast:
Fortunately, a toolbox of thermal management techniques can keep your power supply PCB cool and collected:
Heat sinks: These passive coolers absorb heat from hot components and radiate it into the surrounding air. Various shapes and materials like aluminum or copper can be chosen for optimal heat transfer.
Thermal vias: These tiny copper tubes conduct heat directly from hot components through the PCB to cooler layers or dedicated heat sinks on the other side.
Forced air cooling: Fans actively draw air across the PCB, accelerating heat removal. Different fan types and placements can be chosen based on airflow needs.
Material selection: Using thermally conductive materials for the PCB itself and component leads can improve overall heat dissipation.
Beyond the Basics:
For complex power supply designs, advanced thermal management strategies might be necessary:
Partnering for Thermal Excellence:
At [Your Company Name], we understand the critical role of thermal management in power supply PCBs. Our team of experts offers:
Don't let heat hold your power supply back. Contact [Your Company Name] today and unleash the full potential of your electronics with expert thermal management!
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PCBA Technical Capability
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1. Assembly Type::
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FR4, FPC, Rigid-flex PCB, Metal base PCB.
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2. Assembly Specification:
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Min size L50*W50mm; Max size: L510*460mm
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3. Assembly thickness:
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Min thickness: 0.2mm; Max thickness: 3.0mm
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4. Components Specification
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Components DIP:
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01005Chip/0.35 Pitch BGA
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Minimum device accuracy:
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+/-0.04mm
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Minimum footprint distance:
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0.3mm
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5. File format:
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BOM list; PCB Gerber file:
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6. Test
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IQC:
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Incoming inspection
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IPQC:
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Production inspection; first ICR test
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Visual QC:
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Regularly quality inspection
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SPI test :
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Automatic solder paste optical inspection
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AOI:
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SMD component welding detection, components shortage & component polarity detection
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X-Ravd:
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BGA test; QFN and other precision devices hidden PAD device inspection
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Function test:
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Test function and performance according to the customer's test procedures and steps
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7. Reworking:
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BGA rework equipment
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8. Delivery Time
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Normal delivery time:
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24 hours( fastest 12 hours quick-turn)
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Small production:
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72 hours( fastest 24 hours quick-turn)
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Medium production:
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5 working days.
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9. Capacity:
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SMT assembly 5 million points/day; plug-in & welding 300,000 points/day; 50-100 items/day
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10. Components Service
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A full set of substitute materials:
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Have experience in component procurement sourcing, and management systems, and provide cost-effective services for OEM projects
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Only SMT:
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Do SMT and backhand welding according to components PCB boards provided by customers.
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Components purchasing:
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Customers provide core components, and we provide component sourcing services.
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PCB Specification:
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PCB layers:
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1-24layers
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PCB materials:
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CEM1, CEM3, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free
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PCB max. board size:
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620*1100mm (Custom)
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PCB certificate:
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RoHS Directive-Compliant
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PCB Thickness:
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1.6 ±0.1mm
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Layer Copper Thickness:
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0.5-5oz
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Inner Layer Copper Thickness:
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0.5-4oz
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PCB max. board thickness:
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6.0mm
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Minimum Hole Size:
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0.20mm
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Minimum Line Width/Space:
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3/3mil
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Min. S/M Pitch:
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0.1mm(4mil)
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Plate Thickness and Aperture Ratio :
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30:1
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Minimum Hole Copper:
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20µm
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Hole Dia. Tolerance(PTH):
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±0.075mm(3mil)
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Hole dia. Tolerance(NPTH):
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±0.05mm (2mil)
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Hole Position Deviation:
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±0.05mm (2mil)
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Outline Tolerance:
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±0.05mm (2mil)
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PCB solder mask:
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Black, white, yellow
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PCB surface finished:
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HASL Lead-free, Immersion ENIG, Chem Tin, Flash Gold, OSP, Gold finger, Peelable, Immersion Silver
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Legend:
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White
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E-test:
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100% AOI, X-ray, Flying probe test.
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Outline:
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Rout and Score/V-cut
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Inspection Standard:
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IPC-A-610CCLASSII
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Certificates:
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UL (E503048),ISO9001/ISO14001/IATF16949
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Outgoing Reports:
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Final Inspection, E-test, Solderability Test, Micro Section, and More
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