| Type: | Rigid Circuit Board |
|---|---|
| Dielectric: | FR-4 |
| Material: | Fiberglass Epoxy Resin + Polyimide Resin |
| Samples: |
Anti-static package with high quality carton box
|
|---|
| Customization: |
|---|
|
Shipping Cost:
Estimated freight per unit. |
about shipping cost and estimated delivery time. |
|---|
| Payment Method: |
|
|---|---|
| Initial Payment Full Payment |
| Currency: | US$ |
|---|
| Return&refunds: | You can apply for a refund up to 30 days after receipt of the products. |
|---|
Suppliers with verified business licenses
Audited Supplier 
|
PCBA Technical Capability
|
|
|
1. Assembly Type::
|
FR4, FPC, Rigid-flex PCB, Metal base PCB.
|
|
2. Assembly Specification:
|
Min size L50*W50mm; Max size: L510*460mm
|
|
3. Assembly thickness:
|
Min thickness: 0.2mm; Max thickness: 3.0mm
|
|
4. Components Specification
|
|
|
Components DIP:
|
01005Chip/0.35 Pitch BGA
|
|
Minimum device accuracy:
|
+/-0.04mm
|
|
Minimum footprint distance:
|
0.3mm
|
|
5. File format:
|
BOM list; PCB Gerber file:
|
|
6. Test
|
|
|
IQC:
|
Incoming inspection
|
|
IPQC:
|
Production inspection; first ICR test
|
|
Visual QC:
|
Regularly quality inspection
|
|
SPI test :
|
Automatic solder paste optical inspection
|
|
AOI:
|
SMD component welding detection, components shortage & component polarity detection
|
|
X-Ravd:
|
BGA test; QFN and other precision devices hidden PAD device inspection
|
|
Function test:
|
Test function and performance according to the customer's test procedures and steps
|
|
7. Reworking:
|
BGA rework equipment
|
|
8. Delivery Time
|
|
|
Normal delivery time:
|
24 hours( fastest 12 hours quick-turn)
|
|
Small production:
|
72 hours( fastest 24 hours quick-turn)
|
|
Medium production:
|
5 working days.
|
|
9. Capacity:
|
SMT assembly 5 million points/day; plug-in & welding 300,000 points/day; 50-100 items/day
|
|
10. Components Service
|
|
|
A full set of substitute materials:
|
Have experience in component procurement sourcing, and management systems, and provide cost-effective services for OEM projects
|
|
Only SMT:
|
Do SMT and backhand welding according to components PCB boards provided by customers.
|
|
Components purchasing:
|
Customers provide core components, and we provide component sourcing services.
|
|
PCB Specification:
|
|||||
|
PCB layers:
|
1-24layers
|
||||
|
PCB materials:
|
CEM1, CEM3, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free
|
||||
|
PCB max. board size:
|
620*1100mm (Custom)
|
||||
|
PCB certificate:
|
RoHS Directive-Compliant
|
||||
|
PCB Thickness:
|
1.6 ±0.1mm
|
||||
|
Layer Copper Thickness:
|
0.5-5oz
|
||||
|
Inner Layer Copper Thickness:
|
0.5-4oz
|
||||
|
PCB max. board thickness:
|
6.0mm
|
||||
|
Minimum Hole Size:
|
0.20mm
|
||||
|
Minimum Line Width/Space:
|
3/3mil
|
||||
|
Min. S/M Pitch:
|
0.1mm(4mil)
|
||||
|
Plate Thickness and Aperture Ratio :
|
30:1
|
||||
|
Minimum Hole Copper:
|
20µm
|
||||
|
Hole Dia. Tolerance(PTH):
|
±0.075mm(3mil)
|
||||
|
Hole dia. Tolerance(NPTH):
|
±0.05mm (2mil)
|
||||
|
Hole Position Deviation:
|
±0.05mm (2mil)
|
||||
|
Outline Tolerance:
|
±0.05mm (2mil)
|
||||
|
PCB solder mask:
|
Black, white, yellow
|
||||
|
PCB surface finished:
|
HASL Lead-free, Immersion ENIG, Chem Tin, Flash Gold, OSP, Gold finger, Peelable, Immersion Silver
|
||||
|
Legend:
|
White
|
||||
|
E-test:
|
100% AOI, X-ray, Flying probe test.
|
||||
|
Outline:
|
Rout and Score/V-cut
|
||||
|
Inspection Standard:
|
IPC-A-610CCLASSII
|
||||
|
Certificates:
|
UL (E503048),ISO9001/ISO14001/IATF16949
|
||||
|
Outgoing Reports:
|
Final Inspection, E-test, Solderability Test, Micro Section, and More
|
||||
Suppliers with verified business licenses
Audited Supplier 
){kind=link}
){kind=link}