Multilayer Flex PCB 12V Audio Amplifier Drone Circuit Board with Remote Control

Product Details
Customization: Available
Type: Rigid Circuit Board
Dielectric: FR-4
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Number of Employees
45
Year of Establishment
2003-04-03
  • Multilayer Flex PCB 12V Audio Amplifier Drone Circuit Board with Remote Control
  • Multilayer Flex PCB 12V Audio Amplifier Drone Circuit Board with Remote Control
  • Multilayer Flex PCB 12V Audio Amplifier Drone Circuit Board with Remote Control
  • Multilayer Flex PCB 12V Audio Amplifier Drone Circuit Board with Remote Control
  • Multilayer Flex PCB 12V Audio Amplifier Drone Circuit Board with Remote Control
  • Multilayer Flex PCB 12V Audio Amplifier Drone Circuit Board with Remote Control
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Basic Info.

Model NO.
subwoofer pcb
Application
Consumer Electronics
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Electrolytic Foil
Base Material
Copper
Insulation Materials
Organic Resin
Brand
Finestpcb
Product Name
OEM PCB PCBA Board Assembly
Production Type
Quick Turn PCB Assembly
Application 1
Drone PCB
Service
Electronic Manufacturing Service
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Transport Package
Vacuum Package for Bare PCB and ESD Package
Specification
customized
Trademark
finest
Origin
China
HS Code
8534001000
Production Capacity
30000 Pieces

Packaging & Delivery

Package Size
20.00cm * 10.00cm * 5.00cm
Package Gross Weight
0.200kg
Lead Time
15 days (1 - 20 Pieces)
To be negotiated ( > 20 Pieces)

Product Description

Versatile Multilayer Flex PCBs for Advanced Applications

At Finest Printed Circuit Board Limited, we excel in delivering cutting-edge PCB solutions tailored for complex electronic systems. Our multilayer flex PCBs are engineered to meet the demands of modern audio amplification and drone technology, incorporating advanced features like remote control integration.

Premium Multilayer Flex PCB for 12V Audio Amplifiers

Our multilayer flex PCBs designed for 12V audio amplifiers offer superior performance and reliability, making them ideal for high-fidelity sound systems and portable audio solutions.

  • Enhanced Flexibility: Utilizes flexible substrates that conform to various shapes, enabling compact and space-efficient designs.
  • High-Quality Signal Transmission: Engineered to support high-frequency audio signals with minimal interference and distortion, ensuring pristine sound quality.
  • Durable Construction: Built to withstand mechanical stress and vibrations, maintaining reliable performance in diverse environments.

Advanced Drone Circuit Boards with Remote Control Integration

Our PCBs for drone applications integrate seamlessly with remote control systems, enhancing functionality and user experience for advanced aerial technology.

  • Precision Engineering: Designed for accurate signal processing and control, ensuring responsive and reliable drone operation.
  • Compact and Lightweight: Optimized for minimal weight and space, crucial for maintaining drone agility and flight efficiency.
  • Robust Connectivity: Incorporates advanced features to support stable communication between the drone and its remote control, enhancing control range and reliability.

Key Features and Benefits

  • Multilayer Design: Features multiple layers for increased circuit density and functionality, allowing for complex and high-performance designs.
  • Custom Flexibility: The flexible nature of the PCB allows for versatile mounting options and integration into compact or irregularly shaped devices.
  • Reliable Performance: Built with high-quality materials and precision manufacturing processes to ensure durability and consistent performance.
  • Efficient Heat Dissipation: Engineered to manage heat effectively, preventing overheating and ensuring stable operation during intensive use.

Tailored Solutions for Diverse Applications

  • Audio Amplification: Ideal for high-performance audio systems, providing clear and powerful sound with reliable amplifier circuitry.
  • Drone Technology: Enhances the functionality of drones by integrating advanced control and communication features, supporting various flight modes and remote operations.
  • Remote Control Integration: Facilitates seamless interaction between the device and its remote control, offering intuitive control and enhanced user experience.

Why Choose Our PCBs?

  • Expert Manufacturing: Our team specializes in advanced PCB technologies, ensuring high-quality results for complex and demanding applications.
  • Customization Options: We offer flexible design solutions tailored to meet your specific project requirements, whether for audio amplifiers or drone systems.
  • Commitment to Excellence: We adhere to strict quality control measures, delivering products that meet the highest standards of performance and reliability.
  • Innovative Approach: Our focus on innovation ensures that we provide cutting-edge solutions that keep pace with technological advancements.

Request a Quote Today

For top-tier multilayer flex PCBs designed for 12V audio amplifiers and drone circuit boards with remote control integration, contact Finest Printed Circuit Board Limited. Our team is ready to provide detailed quotes and support tailored to your project's unique needs. Reach out to discover how our advanced PCB solutions can elevate your electronic systems and ensure exceptional performance.

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PCBA Technical Capability
 
1. Assembly Type::
FR4, FPC, Rigid-flex PCB, Metal base PCB.
2. Assembly Specification:
Min size L50*W50mm; Max size: L510*460mm
3. Assembly thickness:
Min thickness: 0.2mm; Max thickness: 3.0mm
4. Components Specification
 
Components DIP:
01005Chip/0.35 Pich BGA
Minimum device accuracy:
+/-0.04mm
Minimum footprint distance:
0.3mm
5. File format:
BOM list; PCB Gerber file:
6. Test
 
IQC:
Incoming inspection
IPQC:
Production inspection; first ICR test
Visual QC:
Regularly quality inspection
SPI test :
Automatic solder paste optical inspection
AOI:
SMD component welding detection, components shortage & component polarity detection
X-Ravd:
BGA test; QFN and other precision devices hidden PAD device inspection
Function test:
Test function and performance according to the customer's test procedures and steps
7. Reworking:
BGA rework equipment
8. Delivery Time
 
Normal delivery time:
24 hours( fastest 12 hours quick-turn)
Small production:
72 hours( fastest 24 hours quick-turn)
Medium production:
5 working days.
9. Capacity:
SMT assembly 5 million points/day; plug-in & welding 300,000 points/day; 50-100 items/day
10. Components Service
 
A full set of substitute materials:
Have experience in component procurement sourcing, and management systems, and provide cost-effective services for OEM projects
Only SMT:
Do SMT and backhand welding according to components PCB boards provided by customers.
Components purchasing:
Customers provide core components, and we provide component sourcing services.
 
PCB Specification:
PCB layers:
1-24layers
PCB materials:
CEM1, CEM3, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free
PCB max. board size:
620*1100mm (Custom)
PCB certificate:
RoHS Directive-Compliant
PCB Thickness:
1.6 ±0.1mm
Layer Copper Thickness:
0.5-5oz
Inner Layer Copper Thickness:
0.5-4oz
PCB max. board thickness:
6.0mm
Minimum Hole Size:
0.20mm
Minimum Line Width/Space:
3/3mil
Min. S/M Pitch:
0.1mm(4mil)
Plate Thickness and Aperture Ratio :
30:1
Minimum Hole Copper:
20µm
Hole Dia. Tolerance(PTH):
±0.075mm(3mil)
Hole dia. Tolerance(NPTH):
±0.05mm (2mil)
Hole Position Deviation:
±0.05mm (2mil)
Outline Tolerance:
±0.05mm (2mil)
PCB solder mask:
Black, white, yellow
PCB surface finished:
HASL Lead-free, Immersion ENIG, Chem Tin, Flash Gold, OSP, Gold finger, Peelable, Immersion Silver
Legend:
White
E-test:
100% AOI, X-ray, Flying probe test.
Outline:
Rout and Score/V-cut
Inspection Standard:
IPC-A-610CCLASSII
Certificates:
UL (E503048),ISO9001/ISO14001/IATF16949
Outgoing Reports:
Final Inspection, E-test, Solderability Test, Micro Section, and More

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