Customization: | Available |
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Type: | Rigid Circuit Board |
Dielectric: | FR-4 |
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Customized PCB Solutions for High-Performance Applications
Finest Printed Circuit Board Limited offers expert PCB and PCBA manufacturing services tailored for advanced technology needs. Our comprehensive PCB Assembly Service is designed to address the demands of high-performance applications, including Bluetooth 60 keyboards, 1000W amplifiers, RFID systems, and 3.5mm interface boards.
Tailored PCB Design and Assembly
Our PCB Assembly Service ensures precision and quality throughout the production process, from design to final assembly. We provide custom solutions that cater to various high-tech applications, ensuring optimal performance and reliability.
Bluetooth 60 Keyboard Boards:
1000W Amplifier PCBs:
RFID PCBs:
3.5mm Interface Boards:
Key Features and Advantages
Our services are structured to meet common customer concerns, delivering high-quality and efficient PCB solutions:
Precision and Reliability:
Efficient Production:
Quality Assurance:
Custom Solutions for Diverse Needs
Our PCB Assembly Service is designed to be flexible and customizable to suit your specific project requirements:
Request Your Custom Quote
Finest Printed Circuit Board Limited is committed to providing superior PCB and PCBA solutions for high-tech applications. Reach out today to request a quote and learn how our tailored PCB Assembly Service can enhance your project's performance and reliability. Our team of professionals is here to provide expert support and deliver results that meet your highest expectations.
PCBA Technical Capability
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1. Assembly Type::
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FR4, FPC, Rigid-flex PCB, Metal base PCB.
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2. Assembly Specification:
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Min size L50*W50mm; Max size: L510*460mm
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3. Assembly thickness:
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Min thickness: 0.2mm; Max thickness: 3.0mm
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4. Components Specification
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Components DIP:
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01005Chip/0.35 Pitch BGA
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Minimum device accuracy:
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+/-0.04mm
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Minimum footprint distance:
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0.3mm
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5. File format:
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BOM list; PCB Gerber file:
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6. Test
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IQC:
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Incoming inspection
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IPQC:
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Production inspection; first ICR test
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Visual QC:
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Regularly quality inspection
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SPI test :
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Automatic solder paste optical inspection
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AOI:
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SMD component welding detection, components shortage & component polarity detection
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X-Ravd:
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BGA test; QFN and other precision devices hidden PAD device inspection
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Function test:
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Test function and performance according to the customer's test procedures and steps
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7. Reworking:
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BGA rework equipment
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8. Delivery Time
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Normal delivery time:
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24 hours( fastest 12 hours quick-turn)
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Small production:
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72 hours( fastest 24 hours quick-turn)
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Medium production:
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5 working days.
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9. Capacity:
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SMT assembly 5 million points/day; plug-in & welding 300,000 points/day; 50-100 items/day
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10. Components Service
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A full set of substitute materials:
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Have experience in component procurement sourcing, and management systems, and provide cost-effective services for OEM projects
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Only SMT:
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Do SMT and backhand welding according to components PCB boards provided by customers.
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Components purchasing:
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Customers provide core components, and we provide component sourcing services.
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PCB Specification:
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PCB layers:
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1-24layers
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PCB materials:
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CEM1, CEM3, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free
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PCB max. board size:
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620*1100mm (Custom)
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PCB certificate:
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RoHS Directive-Compliant
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PCB Thickness:
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1.6 ±0.1mm
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Layer Copper Thickness:
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0.5-5oz
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Inner Layer Copper Thickness:
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0.5-4oz
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PCB max. board thickness:
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6.0mm
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Minimum Hole Size:
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0.20mm
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Minimum Line Width/Space:
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3/3mil
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Min. S/M Pitch:
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0.1mm(4mil)
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Plate Thickness and Aperture Ratio :
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30:1
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Minimum Hole Copper:
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20µm
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Hole Dia. Tolerance(PTH):
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±0.075mm(3mil)
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Hole dia. Tolerance(NPTH):
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±0.05mm (2mil)
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Hole Position Deviation:
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±0.05mm (2mil)
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Outline Tolerance:
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±0.05mm (2mil)
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PCB solder mask:
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Black, white, yellow
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PCB surface finished:
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HASL Lead-free, Immersion ENIG, Chem Tin, Flash Gold, OSP, Gold finger, Peelable, Immersion Silver
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Legend:
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White
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E-test:
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100% AOI, X-ray, Flying probe test.
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Outline:
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Rout and Score/V-cut
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Inspection Standard:
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IPC-A-610CCLASSII
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Certificates:
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UL (E503048),ISO9001/ISO14001/IATF16949
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Outgoing Reports:
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Final Inspection, E-test, Solderability Test, Micro Section, and More
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