Advanced PCB Stackup Technology Complex Multilayer Circuit Board Impedance Control 12-Layer PCB

Product Details
Customization: Available
Type: Rigid Circuit Board
Dielectric: FR-4
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Number of Employees
45
Year of Establishment
2003-04-03
  • Advanced PCB Stackup Technology Complex Multilayer Circuit Board Impedance Control 12-Layer PCB
  • Advanced PCB Stackup Technology Complex Multilayer Circuit Board Impedance Control 12-Layer PCB
  • Advanced PCB Stackup Technology Complex Multilayer Circuit Board Impedance Control 12-Layer PCB
  • Advanced PCB Stackup Technology Complex Multilayer Circuit Board Impedance Control 12-Layer PCB
  • Advanced PCB Stackup Technology Complex Multilayer Circuit Board Impedance Control 12-Layer PCB
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Basic Info.

Model NO.
12-layer PCB
Material
Fiberglass Epoxy
Application
Consumer Electronics
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Electrolytic Foil
Base Material
Copper
Insulation Materials
Organic Resin
Brand
Finestpcb
Service
One-Step PCB Service
Solder Mask Color
Blue.Green.Red.Black.White
Layer
1-40layers
Min BGA Ball Pitch
0.4mm
Surface Finishing
HASL\OSP\Immersion Gold
HASL\OSP\Immersion Gold
Fr4/Rogers/Aluminum/High Tg
Copper Thickness
0.5-5oz
Board Thickness
1.6 ±0.1mm
Minimum Hole
Minimum
Minimum Width
3/3mil
Minimum Line
3/3mil
Product Name
OEM PCB PCBA Board Assembly
Transport Package
Vacuum Package for Bare PCB and ESD Package
Specification
customized
Trademark
finest
Origin
China
HS Code
8534001000
Production Capacity
30000 Pieces

Packaging & Delivery

Package Size
10.00cm * 10.00cm * 5.00cm
Package Gross Weight
1.000kg
Lead Time
10 days (1 - 10 Pieces)
To be negotiated ( > 10 Pieces)

Product Description


Product Title: 12-Layer PCB for Enhanced Performance

Product Benefits:

Upgrade your electronic projects with our cutting-edge 12-Layer PCB, meticulously designed for optimal performance and reliability. Explore the benefits that set our product apart:

High-Speed Connectivity: Experience seamless data transmission with the advanced architecture of our 12-layer PCB.

Enhanced Signal Integrity: Ensure your signals remain robust and stable, minimizing interference for superior overall performance.

Improved Thermal Management: The carefully engineered layers contribute to efficient heat dissipation, promoting longevity and sustained functionality.

Compact Design: Achieve more with less space as our 12-layer PCB offers increased functionality without compromising on size.

Product Features:

Product Specifications:

Layers: 12
Material: High-quality FR-4
Thickness: 1.6mm
Copper Weight: 1oz
Surface Finish: ENIG
Min Trace/Spacing: 4/4 mil
Key Features:

Advanced Multilayer Architecture
RoHS Compliant Materials
Precise Dimensional Control
Impedance Control for Signal Integrity
High-Temperature Tolerance
Elevate your electronic designs with our 12-Layer PCB, where innovation meets reliability. Upgrade today for a seamless and efficient circuit board solution.


Advanced PCB Stackup Technology Complex Multilayer Circuit Board Impedance Control 12-Layer PCBAdvanced PCB Stackup Technology Complex Multilayer Circuit Board Impedance Control 12-Layer PCBAdvanced PCB Stackup Technology Complex Multilayer Circuit Board Impedance Control 12-Layer PCBAdvanced PCB Stackup Technology Complex Multilayer Circuit Board Impedance Control 12-Layer PCBAdvanced PCB Stackup Technology Complex Multilayer Circuit Board Impedance Control 12-Layer PCBAdvanced PCB Stackup Technology Complex Multilayer Circuit Board Impedance Control 12-Layer PCBAdvanced PCB Stackup Technology Complex Multilayer Circuit Board Impedance Control 12-Layer PCBAdvanced PCB Stackup Technology Complex Multilayer Circuit Board Impedance Control 12-Layer PCBAdvanced PCB Stackup Technology Complex Multilayer Circuit Board Impedance Control 12-Layer PCBAdvanced PCB Stackup Technology Complex Multilayer Circuit Board Impedance Control 12-Layer PCBAdvanced PCB Stackup Technology Complex Multilayer Circuit Board Impedance Control 12-Layer PCB

Advanced PCB Stackup Technology Complex Multilayer Circuit Board Impedance Control 12-Layer PCB

Advanced PCB Stackup Technology Complex Multilayer Circuit Board Impedance Control 12-Layer PCB

 
Advanced PCB Stackup Technology Complex Multilayer Circuit Board Impedance Control 12-Layer PCB
Advanced PCB Stackup Technology Complex Multilayer Circuit Board Impedance Control 12-Layer PCB
 
Advanced PCB Stackup Technology Complex Multilayer Circuit Board Impedance Control 12-Layer PCB
Advanced PCB Stackup Technology Complex Multilayer Circuit Board Impedance Control 12-Layer PCB

Advanced PCB Stackup Technology Complex Multilayer Circuit Board Impedance Control 12-Layer PCB
Advanced PCB Stackup Technology Complex Multilayer Circuit Board Impedance Control 12-Layer PCB
Advanced PCB Stackup Technology Complex Multilayer Circuit Board Impedance Control 12-Layer PCB


Why choose Finest PCB Assembly?
1. More than 19 years experience of in electronic manufacturing services for PCB making.
2. One-stop service | PCB Manufacturing | Components sourcing and PCB assembly one-stop PCBA service to help you easily achieve your electronic products.
3. More than 1000 customers working with us for telecom, IOT, RF, smart control, security, medical, industrial, automotive, 3G / 4G / 5G products.
4. Reasonable and stable price: have established a strong global electronics components supply chain that helps us get
reasonable and stable price
5. Quality assurance: more than 15 years of experience in the engineering team and quality control team to ensure
all products come out under control.
6. Professional replace-solution: help customers source professional replace-solution to achieve faster, lower cost with high-quality components purchasing agent service.

 
PCBA Technical Capability
 
1. Assembly Type::
FR4, FPC, Rigid-flex PCB, Metal base PCB.
2. Assembly Specification:
Min size L50*W50mm; Max size: L510*460mm
3. Assembly thickness:
Min thickness: 0.2mm; Max thickness: 3.0mm
4. Components Specification
 
Components DIP:
01005Chip/0.35 Pitch BGA
Minimum device accuracy:
+/-0.04mm
Minimum footprint distance:
0.3mm
5. File format:
BOM list; PCB Gerber file:
6. Test
 
IQC:
Incoming inspection
IPQC:
Production inspection; first ICR test
Visual QC:
Regularly quality inspection
SPI test :
Automatic solder paste optical inspection
AOI:
SMD component welding detection, components shortage & component polarity detection
X-Ravd:
BGA test; QFN and other precision devices hidden PAD device inspection
Function test:
Test function and performance according to the customer's test procedures and steps
7. Reworking:
BGA rework equipment
8. Delivery Time
 
Normal delivery time:
24 hours( fastest 12 hours quick-turn)
Small production:
72 hours( fastest 24 hours quick-turn)
Medium production:
5 working days.
9. Capacity:
SMT assembly 5 million points/day; plug-in & welding 300,000 points/day; 50-100 items/day
10. Components Service
 
A full set of substitute materials:
Have experience in component procurement sourcing, and management systems, and provide cost-effective services for OEM projects
Only SMT:
Do SMT and backhand welding according to components PCB boards provided by customers.
Components purchasing:
Customers provide core components, and we provide component sourcing services.
PCB Specification:
PCB layers:
1-24layers
PCB materials:
CEM1, CEM3, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free
PCB max. board size:
620*1100mm (Custom)
PCB certificate:
RoHS Directive-Compliant
PCB Thickness:
1.6 ±0.1mm
Layer Copper Thickness:
0.5-5oz
Inner Layer Copper Thickness:
0.5-4oz
PCB max. board thickness:
6.0mm
Minimum Hole Size:
0.20mm
Minimum Line Width/Space:
3/3mil
Min. S/M Pitch:
0.1mm(4mil)
Plate Thickness and Aperture Ratio :
30:1
Minimum Hole Copper:
20µm
Hole Dia. Tolerance(PTH):
±0.075mm(3mil)
Hole dia. Tolerance(NPTH):
±0.05mm (2mil)
Hole Position Deviation:
±0.05mm (2mil)
Outline Tolerance:
±0.05mm (2mil)
PCB solder mask:
Black, white, yellow
PCB surface finished:
HASL Lead-free, Immersion ENIG, Chem Tin, Flash Gold, OSP, Gold finger, Peelable, Immersion Silver
Legend:
White
E-test:
100% AOI, X-ray, Flying probe test.
Outline:
Rout and Score/V-cut
Inspection Standard:
IPC-A-610CCLASSII
Certificates:
UL (E503048),ISO9001/ISO14001/IATF16949
Outgoing Reports:
Final Inspection, E-test, Solderability Test, Micro Section, and More


FAQ
1. who are we?
We are based in Guangdong, China, and start from 2019, sell to Domestic Market(50.00%), North America(15.00%), South
America(12.00%),Northern Europe(12.00%),Western Europe(5.00%),Southeast Asia(2.00%),Mid East(2.00%),Eastern Europe(2.00%). There
are a total of about 301-500 people in our office.

2. how can we guarantee quality?
Always a pre-production sample before mass production;
Always final Inspection before shipment;

3. what can you buy from us?
PCBA, PCB Assembly, PCBA Board, LED PCBA, Electronic PCBA

4. why should you buy from us not from other suppliers?
*A 18-year one-stop solution provider *Strong R&D group with 30 engineers *Monthly output:45000 sqm of PCBs and PCBAs*4500-square-meter factory *Eight SMT production-line *Automatic SMT, Reflow machine, AOI&x-RAY *Fast response, reply within 24hrs

5. what services can we provide?
Accepted Delivery Terms: FOB, CIF, EXW, Express Delivery;
Accepted Payment Currency: USD, EUR, GBP;
Accepted Payment Type: T/T, L/C, MoneyGram, Western Union;
Language Spoken: English, French


 

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