| Customization: | Available |
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| Type: | Rigid Circuit Board |
| Dielectric: | FR-4 |
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Precision-Made Rigid PCBs for KBD67 Lite, Bluetooth, and Amplifier Systems
At Finest Printed Circuit Board Limited, we specialize in manufacturing high-quality rigid PCBs and PCBA solutions tailored to your specific needs. Our products include the KBD67 Lite Bluetooth dual-mode circuit board, 2N3055 amplifier PCB, and audio equalizer boards, designed to deliver exceptional performance and reliability.
Innovative Rigid PCBs for Enhanced Performance
Our rigid PCBs are crafted to provide durability and precision for a variety of applications, including advanced audio systems and Bluetooth devices.
Durable Design:
Precision Engineering:
Customized KBD67 Lite Bluetooth Dual-Mode Circuit Boards
We offer customized circuit boards for the KBD67 Lite, integrating Bluetooth dual-mode functionality to enhance user experience.
Advanced Bluetooth Integration:
Tailored Design:
High-Power 2N3055 Amplifier PCBs
Our 2N3055 amplifier PCBs are engineered to handle high power requirements, ensuring superior audio amplification.
Robust Amplifier Design:
Efficient Assembly:
Audio Equalizer Circuit Boards
Our audio equalizer circuit boards are crafted for precision and clarity in sound engineering.
Enhanced Audio Control:
High-Quality Materials:
Why Partner with Us?
Finest Printed Circuit Board Limited offers solutions tailored to your exact needs, addressing common concerns with precision and efficiency.
Custom Solutions:
Commitment to Quality:
Expert Support:
Request a Quote Today
Contact Finest Printed Circuit Board Limited to request a quote for your customized KBD67 Lite Bluetooth, 2N3055 amplifier, or audio equalizer PCB needs. Our dedication to quality and customer satisfaction ensures your project will be handled with the utmost care and precision.
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PCBA Technical Capability
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1. Assembly Type::
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FR4, FPC, Rigid-flex PCB, Metal base PCB.
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2. Assembly Specification:
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Min size L50*W50mm; Max size: L510*460mm
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3. Assembly thickness:
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Min thickness: 0.2mm; Max thickness: 3.0mm
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4. Components Specification
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Components DIP:
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01005Chip/0.35 Pitch BGA
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Minimum device accuracy:
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+/-0.04mm
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Minimum footprint distance:
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0.3mm
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5. File format:
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BOM list; PCB Gerber file:
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6. Test
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IQC:
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Incoming inspection
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IPQC:
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Production inspection; first ICR test
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Visual QC:
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Regularly quality inspection
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SPI test :
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Automatic solder paste optical inspection
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AOI:
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SMD component welding detection, components shortage & component polarity detection
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X-Ravd:
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BGA test; QFN and other precision devices hidden PAD device inspection
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Function test:
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Test function and performance according to the customer's test procedures and steps
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7. Reworking:
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BGA rework equipment
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8. Delivery Time
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Normal delivery time:
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24 hours( fastest 12 hours quick-turn)
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Small production:
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72 hours( fastest 24 hours quick-turn)
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Medium production:
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5 working days.
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9. Capacity:
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SMT assembly 5 million points/day; plug-in & welding 300,000 points/day; 50-100 items/day
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10. Components Service
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A full set of substitute materials:
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Have experience in component procurement sourcing, and management systems, and provide cost-effective services for OEM projects
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Only SMT:
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Do SMT and backhand welding according to components PCB boards provided by customers.
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Components purchasing:
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Customers provide core components, and we provide component sourcing services.
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PCB Specification:
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PCB layers:
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1-24layers
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PCB materials:
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CEM1, CEM3, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free
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PCB max. board size:
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620*1100mm (Custom)
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PCB certificate:
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RoHS Directive-Compliant
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PCB Thickness:
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1.6 ±0.1mm
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Layer Copper Thickness:
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0.5-5oz
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Inner Layer Copper Thickness:
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0.5-4oz
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PCB max. board thickness:
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6.0mm
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Minimum Hole Size:
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0.20mm
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Minimum Line Width/Space:
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3/3mil
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Min. S/M Pitch:
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0.1mm(4mil)
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Plate Thickness and Aperture Ratio :
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30:1
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Minimum Hole Copper:
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20µm
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Hole Dia. Tolerance(PTH):
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±0.075mm(3mil)
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Hole dia. Tolerance(NPTH):
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±0.05mm (2mil)
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Hole Position Deviation:
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±0.05mm (2mil)
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Outline Tolerance:
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±0.05mm (2mil)
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PCB solder mask:
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Black, white, yellow
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PCB surface finished:
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HASL Lead-free, Immersion ENIG, Chem Tin, Flash Gold, OSP, Gold finger, Peelable, Immersion Silver
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Legend:
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White
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E-test:
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100% AOI, X-ray, Flying probe test.
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Outline:
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Rout and Score/V-cut
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Inspection Standard:
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IPC-A-610CCLASSII
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Certificates:
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UL (E503048),ISO9001/ISO14001/IATF16949
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Outgoing Reports:
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Final Inspection, E-test, Solderability Test, Micro Section, and More
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