| Customization: | Available |
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| Type: | Rigid Circuit Board |
| Dielectric: | FR-4 |
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Introducing Finest Printed Circuit Board Limited's Factory HASL, OSP, and Immersion Gold Rigid Customized Mobile Phone Motherboard MCPCB and 8-Layer PCB Stack-Up services. As a professional PCB and PCBA manufacturer, we are dedicated to addressing the unique challenges our customers face and delivering high-quality, tailored solutions that meet their specific needs.
Advanced Surface Finishes: HASL, OSP, and Immersion Gold
Our factory offers a variety of advanced surface finishes, including Hot Air Solder Leveling (HASL), Organic Solderability Preservative (OSP), and Immersion Gold, to meet the diverse needs of your projects. HASL provides a reliable and cost-effective solution for protecting your PCB surfaces and ensuring excellent solderability. OSP offers an eco-friendly, lead-free option that preserves copper pads for high solderability without compromising the environment. Immersion Gold is ideal for high-performance applications, offering superior surface planarity and excellent conductivity, essential for complex and high-density PCB designs.
Customized Mobile Phone Motherboard Solutions
Mobile phone motherboards require precision and reliability to support the myriad of functions in modern smartphones. Our customized motherboard solutions are designed to meet the exact specifications of your projects, ensuring optimal performance and longevity. With our expertise in rigid PCB manufacturing, we provide robust and durable motherboards that can handle the high-stress environments of mobile devices.
Metal Core PCBs (MCPCB) for Enhanced Thermal Management
Our MCPCB solutions are perfect for applications that require efficient thermal management. Metal Core PCBs are designed to dissipate heat effectively, which is crucial for high-power applications such as LED lighting and power supplies. By integrating metal cores, typically aluminum or copper, into the PCB design, we enhance the thermal performance and reliability of your products.
8-Layer PCB Stack-Up for Complex Designs
Our 8-layer PCB stack-up solutions offer greater design flexibility and improved performance for complex electronic systems. Multi-layer PCBs provide enhanced signal integrity, reduced electromagnetic interference (EMI), and better power distribution, making them ideal for advanced applications. Our meticulous approach to 8-layer stack-up design ensures that each layer is optimized for its specific function, resulting in a PCB that delivers exceptional performance and reliability.
Precision Manufacturing and Assembly
At Finest Printed Circuit Board Limited, we leverage state-of-the-art manufacturing technology and rigorous quality control processes to produce high-precision PCBs. Our advanced equipment and meticulous assembly procedures ensure that each PCB meets the highest standards of quality and performance. From component placement to soldering and testing, we handle every step of the process with precision and care, delivering PCBs that perform reliably in the field.
Tailored Solutions for Unique Challenges
We understand that every project has unique requirements and challenges. That's why we offer fully customized solutions to meet your specific needs. Our team of experts works closely with you from the initial design phase through to final production, ensuring that every aspect of your PCB is optimized for your application. This collaborative approach guarantees that your final product meets all your performance and reliability expectations.
Comprehensive Quality Assurance
Quality is our top priority. Our comprehensive quality assurance processes ensure that every PCB we produce meets the highest standards of performance and reliability. We conduct thorough testing and inspections at every stage of production, from initial design to final assembly. This rigorous approach ensures that your products are free from defects and ready for use, providing you with peace of mind and confidence in the reliability of your products.
Efficient Production and Fast Turnaround
In today's competitive market, speed and efficiency are crucial. Our streamlined manufacturing processes and efficient project management ensure fast turnaround times without compromising on quality. Whether you need quick prototypes or full-scale production runs, we are equipped to meet your deadlines and help you bring your products to market faster.
Competitive Pricing and Value
We offer competitive pricing for our customized PCB assembly services, ensuring that you receive the best value for your investment. Our goal is to provide high-quality PCBs at a cost-effective price, helping you reduce costs while maintaining the highest standards of performance and reliability. This balance of quality and affordability makes us the ideal partner for your PCB manufacturing needs.
Dedicated Customer Support
At Finest Printed Circuit Board Limited, customer satisfaction is our top priority. Our dedicated customer support team is always available to address your concerns and provide timely updates on your project. We believe in building long-term relationships with our customers, and we are committed to supporting you throughout the entire lifecycle of your product.
Request a Quote Today
If you are looking for a reliable partner for your factory HASL, OSP, Immersion Gold rigid customized mobile phone motherboard MCPCB, and 8-layer PCB stack-up needs, look no further than Finest Printed Circuit Board Limited. Our tailored solutions are designed to solve your pain points and deliver high-quality, efficient results. Contact us today to request a quote and discover how our expertise can help bring your projects to life.
Trust Finest Printed Circuit Board Limited for your next project and experience the difference that customized high-quality PCB solutions can make.
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PCBA Technical Capability
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1. Assembly Type::
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FR4, FPC, Rigid-flex PCB, Metal base PCB.
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2. Assembly Specification:
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Min size L50*W50mm; Max size: L510*460mm
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3. Assembly thickness:
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Min thickness: 0.2mm; Max thickness: 3.0mm
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4. Components Specification
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Components DIP:
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01005Chip/0.35 Pitch BGA
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Minimum device accuracy:
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+/-0.04mm
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Minimum footprint distance:
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0.3mm
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5. File format:
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BOM list; PCB Gerber file:
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6. Test
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IQC:
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Incoming inspection
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IPQC:
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Production inspection; first ICR test
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Visual QC:
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Regularly quality inspection
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SPI test :
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Automatic solder paste optical inspection
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AOI:
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SMD component welding detection, components shortage & component polarity detection
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X-Ravd:
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BGA test; QFN and other precision devices hidden PAD device inspection
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Function test:
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Test function and performance according to the customer's test procedures and steps
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7. Reworking:
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BGA rework equipment
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8. Delivery Time
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Normal delivery time:
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24 hours( fastest 12 hours quick-turn)
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Small production:
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72 hours( fastest 24 hours quick-turn)
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Medium production:
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5 working days.
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9. Capacity:
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SMT assembly 5 million points/day; plug-in & welding 300,000 points/day; 50-100 items/day
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10. Components Service
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A full set of substitute materials:
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Have experience in component procurement sourcing, and management systems, and provide cost-effective services for OEM projects
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Only SMT:
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Do SMT and backhand welding according to components PCB boards provided by customers.
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Components purchasing:
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Customers provide core components, and we provide component sourcing services.
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PCB Specification:
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PCB layers:
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1-24layers
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PCB materials:
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CEM1, CEM3, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free
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PCB max. board size:
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620*1100mm (Custom)
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PCB certificate:
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RoHS Directive-Compliant
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PCB Thickness:
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1.6 ±0.1mm
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Layer Copper Thickness:
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0.5-5oz
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Inner Layer Copper Thickness:
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0.5-4oz
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PCB max. board thickness:
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6.0mm
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Minimum Hole Size:
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0.20mm
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Minimum Line Width/Space:
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3/3mil
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Min. S/M Pitch:
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0.1mm(4mil)
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Plate Thickness and Aperture Ratio :
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30:1
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Minimum Hole Copper:
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20µm
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Hole Dia. Tolerance(PTH):
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±0.075mm(3mil)
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Hole dia. Tolerance(NPTH):
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±0.05mm (2mil)
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Hole Position Deviation:
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±0.05mm (2mil)
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Outline Tolerance:
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±0.05mm (2mil)
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PCB solder mask:
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Black, white, yellow
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PCB surface finished:
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HASL Lead-free, Immersion ENIG, Chem Tin, Flash Gold, OSP, Gold finger, Peelable, Immersion Silver
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Legend:
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White
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E-test:
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100% AOI, X-ray, Flying probe test.
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Outline:
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Rout and Score/V-cut
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Inspection Standard:
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IPC-A-610CCLASSII
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Certificates:
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UL (E503048),ISO9001/ISO14001/IATF16949
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Outgoing Reports:
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Final Inspection, E-test, Solderability Test, Micro Section, and More
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