| Customization: | Available |
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| Type: | Rigid Circuit Board |
| Dielectric: | FR-4 |
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At Finest Printed Circuit Board Limited, we excel in manufacturing OEM rigid circuit boards and PCB assemblies tailored for advanced consumer electronics. Our expertise includes WS2811-based designs, 4-layer boards, and Bluetooth 5.0 integrations. We focus on delivering high-performance solutions that address common industry challenges and provide seamless integration for your complex projects.
Optimized for RGB LED Applications
Our WS2811 rigid circuit boards are designed to support high-density RGB LED applications. These boards integrate seamlessly with WS2811 LED controllers, ensuring precise color control and synchronization for vibrant, dynamic lighting solutions. The 4-layer design provides robust signal integrity and power distribution, essential for maintaining the performance and reliability of high-end LED displays.
Efficient Heat Dissipation
Effective thermal management is crucial for high-power LED applications to prevent overheating and ensure long-term performance. Our PCBs feature optimized thermal vias and copper pours to efficiently dissipate heat away from critical components. This enhances the durability of your lighting system and maintains consistent brightness levels.
Durable and Reliable Construction
Built with high-quality FR4 material, our WS2811 PCBs are designed to withstand the rigors of continuous operation. The rigid structure ensures mechanical stability, while the precise assembly process guarantees consistent quality and performance in your LED applications.
Complex Circuit Integration
Our motherboards featuring 8 BGA (Ball Grid Array) packages are engineered for high-performance computing and complex circuit integration. The 4-layer PCB design supports advanced features and functionalities, including high-speed data processing and multiple connectivity options. This design is ideal for applications requiring robust performance and reliability.
Enhanced Signal Integrity and Stability
With our advanced PCB technology, signal integrity is maintained across all BGA packages, ensuring stable and reliable operation. The multilayer construction minimizes signal interference and crosstalk, providing a solid foundation for high-speed data transfer and complex processing tasks.
Customizable for Diverse Applications
Whether you need a motherboard for consumer electronics, industrial applications, or specialized devices, our PCBs can be tailored to meet your specific requirements. We work closely with you to customize the design, ensuring that all necessary features are integrated seamlessly.
Future-Proof Bluetooth Technology
Incorporating Bluetooth 5.0 into your PCB design provides enhanced connectivity features, including improved range, faster data transfer, and better energy efficiency. Our PCBs are designed to support these advanced capabilities, ensuring your device remains competitive in the rapidly evolving market.
Optimized for Low Power Consumption
Bluetooth 5.0 technology offers significant improvements in power consumption compared to previous versions. Our PCBs are designed to maximize these benefits, helping to extend battery life and improve the overall energy efficiency of your devices.
Reliable Wireless Performance
Our PCB designs include features to enhance wireless performance, such as optimized antenna layouts and interference reduction techniques. This ensures stable and reliable Bluetooth connectivity, providing a seamless user experience for your end customers.
Complex Design Requirements
Handling complex designs with multiple BGA packages and advanced connectivity features can be challenging. We leverage our extensive experience and advanced manufacturing capabilities to address these complexities, ensuring that every PCB meets your design specifications and performs reliably.
Managing Component Density
Incorporating multiple BGA packages and other high-density components requires precise layout and assembly. Our manufacturing process includes stringent quality control measures to manage component density effectively, preventing issues such as soldering defects and misalignment.
Balancing Performance and Cost
Achieving a balance between high performance and cost-effectiveness is essential. Our efficient production processes and cost management strategies help you get the best value for your investment while delivering top-quality PCBs that meet your performance requirements.
Expertise in Advanced PCB Solutions
Our team of experts is dedicated to providing high-quality PCB solutions for a wide range of applications. From WS2811 LED boards to advanced motherboards and Bluetooth 5.0 integration, we have the expertise to handle your most demanding projects.
Commitment to Quality and Precision
We adhere to the highest standards of quality and precision in every PCB we produce. Our rigorous testing and quality control processes ensure that each board meets industry standards and performs reliably in its intended application.
Flexible and Responsive Service
We understand the importance of timely delivery and responsive service. Our flexible production capabilities and commitment to customer support ensure that your project is completed on time and to your satisfaction.
Ready to enhance your project with high-performance WS2811 rigid circuit boards, advanced motherboards, or Bluetooth 5.0 solutions? Contact Finest Printed Circuit Board Limited for a custom quote tailored to your specific needs. Our team is here to provide the reliable, high-quality PCB solutions you need to achieve your design goals and succeed in the competitive electronics market.
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PCBA Technical Capability
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1. Assembly Type::
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FR4, FPC, Rigid-flex PCB, Metal base PCB.
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2. Assembly Specification:
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Min size L50*W50mm; Max size: L510*460mm
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3. Assembly thickness:
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Min thickness: 0.2mm; Max thickness: 3.0mm
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4. Components Specification
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Components DIP:
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01005Chip/0.35 Pitch BGA
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Minimum device accuracy:
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+/-0.04mm
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Minimum footprint distance:
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0.3mm
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5. File format:
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BOM list; PCB Gerber file:
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6. Test
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IQC:
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Incoming inspection
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IPQC:
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Production inspection; first ICR test
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Visual QC:
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Regularly quality inspection
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SPI test :
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Automatic solder paste optical inspection
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AOI:
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SMD component welding detection, components shortage & component polarity detection
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X-Ravd:
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BGA test; QFN and other precision devices hidden PAD device inspection
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Function test:
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Test function and performance according to the customer's test procedures and steps
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7. Reworking:
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BGA rework equipment
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8. Delivery Time
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Normal delivery time:
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24 hours( fastest 12 hours quick-turn)
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Small production:
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72 hours( fastest 24 hours quick-turn)
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Medium production:
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5 working days.
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9. Capacity:
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SMT assembly 5 million points/day; plug-in & welding 300,000 points/day; 50-100 items/day
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10. Components Service
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A full set of substitute materials:
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Have experience in component procurement sourcing, and management systems, and provide cost-effective services for OEM projects
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Only SMT:
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Do SMT and backhand welding according to components PCB boards provided by customers.
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Components purchasing:
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Customers provide core components, and we provide component sourcing services.
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PCB Specification:
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PCB layers:
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1-24layers
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PCB materials:
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CEM1, CEM3, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free
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PCB max. board size:
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620*1100mm (Custom)
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PCB certificate:
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RoHS Directive-Compliant
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PCB Thickness:
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1.6 ±0.1mm
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Layer Copper Thickness:
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0.5-5oz
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Inner Layer Copper Thickness:
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0.5-4oz
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PCB max. board thickness:
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6.0mm
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Minimum Hole Size:
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0.20mm
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Minimum Line Width/Space:
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3/3mil
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Min. S/M Pitch:
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0.1mm(4mil)
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Plate Thickness and Aperture Ratio :
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30:1
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Minimum Hole Copper:
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20µm
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Hole Dia. Tolerance(PTH):
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±0.075mm(3mil)
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Hole dia. Tolerance(NPTH):
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±0.05mm (2mil)
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Hole Position Deviation:
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±0.05mm (2mil)
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Outline Tolerance:
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±0.05mm (2mil)
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PCB solder mask:
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Black, white, yellow
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PCB surface finished:
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HASL Lead-free, Immersion ENIG, Chem Tin, Flash Gold, OSP, Gold finger, Peelable, Immersion Silver
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Legend:
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White
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E-test:
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100% AOI, X-ray, Flying probe test.
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Outline:
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Rout and Score/V-cut
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Inspection Standard:
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IPC-A-610CCLASSII
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Certificates:
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UL (E503048),ISO9001/ISO14001/IATF16949
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Outgoing Reports:
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Final Inspection, E-test, Solderability Test, Micro Section, and More
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