| Customization: | Available |
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| Type: | Rigid Circuit Board |
| Dielectric: | FR-4 |
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At Finest Printed Circuit Board Limited, we specialize in crafting high-performance OEM rigid circuit boards, particularly for consumer electronics such as mobile phone motherboards and multilayer DC converter PCBs. With our extensive expertise in PCB and PCBA manufacturing, we understand the complex requirements and challenges faced by manufacturers in today's fast-paced electronics market. Whether it's delivering compact, multilayer boards for mobile devices or designing robust, efficient PCBs for DC converters, we offer solutions that tackle your pain points and ensure your products perform at the highest level.
Maximizing Functionality in a Compact Space: Modern mobile phones require PCBs that can support multiple functions in a very compact footprint. Our multilayer PCB designs for mobile phone motherboards are engineered to handle high-density component placement, allowing your devices to integrate advanced features without compromising space. We utilize up to 8-layer stack-ups to accommodate more complex circuitry, ensuring seamless integration of microprocessors, memory modules, power management systems, and more.
Thermal Management for Heat Dissipation: Mobile phone motherboards can generate significant heat due to the high number of components operating simultaneously. Our PCBs are designed with advanced thermal management systems, such as thermal vias and heatsinks, to efficiently dissipate heat and prevent overheating. This extends the lifespan of your device and ensures reliable operation under heavy usage.
Durability and Shock Resistance: With mobile phones subjected to frequent handling, drops, and vibrations, it's essential that the motherboard is durable and shock-resistant. Our rigid circuit boards are manufactured using high-quality materials, such as FR4, to ensure they can withstand the mechanical stresses common in everyday use. This enhances device longevity, reducing the need for repairs and replacements.
Optimized Power Conversion Efficiency: DC converters play a critical role in managing voltage levels in various consumer electronics. Our PCBs for DC converter applications are designed to maximize power conversion efficiency, minimizing energy loss during the process. This ensures that your electronic devices can operate on minimal power while delivering optimal performance, a crucial factor in portable and energy-sensitive applications.
Multi-Layer Design for Enhanced Functionality: Similar to mobile phone motherboards, DC converters often require multilayer PCBs to support complex circuits and multiple voltage conversion stages. Our multilayer PCBs are engineered for high precision, allowing for efficient handling of varying voltage inputs and outputs. This makes them ideal for power management in a wide range of consumer electronics, from mobile devices to industrial applications.
High Reliability and Safety: Safety is a primary concern when it comes to DC converter designs. Our PCBs incorporate features such as overcurrent protection, short circuit protection, and efficient thermal control to prevent damage to both the PCB and the connected devices. This reliability ensures long-term operation and reduces the risk of malfunction, which can be critical for consumer electronics that rely on consistent power management.
Overcoming Design Complexity: Whether designing a mobile phone motherboard or a DC converter, one of the main challenges is managing complex circuits without compromising on performance or space. Our engineering team works closely with your design specifications to ensure we deliver a PCB that balances complexity with reliability. We utilize advanced PCB design software to create custom solutions that match your requirements, all while keeping production costs low.
Reducing EMI and Signal Interference: Both mobile phone motherboards and DC converters are sensitive to electromagnetic interference (EMI), which can degrade performance. Our PCBs are designed with careful trace routing, ground planes, and shielding to minimize EMI. This ensures that your devices maintain stable performance even in environments with high electromagnetic noise.
Cost-Effective and Scalable Production: We understand that cost is a key consideration for manufacturers. Our production processes are optimized to deliver high-quality PCBs at competitive prices, making it easier for you to stay within budget without sacrificing quality. Additionally, our scalable manufacturing capabilities ensure that we can meet both small and large order volumes, giving you the flexibility to adjust production as your needs evolve.
Commitment to Quality: We take pride in delivering PCBs that meet the highest industry standards, including RoHS compliance and ISO certification. Our rigorous quality control processes ensure that each board is thoroughly tested for performance, durability, and reliability before it reaches you.
Expert Engineering Support: Our experienced engineering team is dedicated to providing the best possible solutions for your PCB and PCBA needs. From initial design consultation to final production, we work with you to create PCBs that meet your exact specifications.
Fast Turnaround and On-Time Delivery: Time is critical in the electronics industry, and we understand the importance of meeting deadlines. With our efficient production processes, we offer fast turnaround times to ensure that your products reach the market quickly. Our logistics team ensures on-time delivery, so you never have to worry about production delays.
Looking for a partner who can provide high-quality PCB and PCBA solutions for your mobile phone motherboard or DC converter project? Finest Printed Circuit Board Limited is here to help. Get in touch with our team today to receive a customized quote tailored to your project needs. Let us help you deliver exceptional products with precision-manufactured PCBs that meet your performance expectations.
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PCBA Technical Capability
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1. Assembly Type::
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FR4, FPC, Rigid-flex PCB, Metal base PCB.
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2. Assembly Specification:
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Min size L50*W50mm; Max size: L510*460mm
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3. Assembly thickness:
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Min thickness: 0.2mm; Max thickness: 3.0mm
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4. Components Specification
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Components DIP:
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01005Chip/0.35 Pitch BGA
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Minimum device accuracy:
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+/-0.04mm
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Minimum footprint distance:
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0.3mm
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5. File format:
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BOM list; PCB Gerber file:
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6. Test
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IQC:
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Incoming inspection
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IPQC:
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Production inspection; first ICR test
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Visual QC:
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Regularly quality inspection
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SPI test :
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Automatic solder paste optical inspection
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AOI:
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SMD component welding detection, components shortage & component polarity detection
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X-Ravd:
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BGA test; QFN and other precision devices hidden PAD device inspection
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Function test:
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Test function and performance according to the customer's test procedures and steps
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7. Reworking:
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BGA rework equipment
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8. Delivery Time
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Normal delivery time:
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24 hours( fastest 12 hours quick-turn)
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Small production:
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72 hours( fastest 24 hours quick-turn)
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Medium production:
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5 working days.
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9. Capacity:
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SMT assembly 5 million points/day; plug-in & welding 300,000 points/day; 50-100 items/day
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10. Components Service
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A full set of substitute materials:
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Have experience in component procurement sourcing, and management systems, and provide cost-effective services for OEM projects
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Only SMT:
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Do SMT and backhand welding according to components PCB boards provided by customers.
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Components purchasing:
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Customers provide core components, and we provide component sourcing services.
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PCB Specification:
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PCB layers:
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1-24layers
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PCB materials:
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CEM1, CEM3, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free
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PCB max. board size:
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620*1100mm (Custom)
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PCB certificate:
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RoHS Directive-Compliant
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PCB Thickness:
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1.6 ±0.1mm
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Layer Copper Thickness:
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0.5-5oz
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Inner Layer Copper Thickness:
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0.5-4oz
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PCB max. board thickness:
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6.0mm
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Minimum Hole Size:
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0.20mm
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Minimum Line Width/Space:
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3/3mil
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Min. S/M Pitch:
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0.1mm(4mil)
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Plate Thickness and Aperture Ratio :
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30:1
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Minimum Hole Copper:
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20µm
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Hole Dia. Tolerance(PTH):
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±0.075mm(3mil)
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Hole dia. Tolerance(NPTH):
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±0.05mm (2mil)
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Hole Position Deviation:
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±0.05mm (2mil)
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Outline Tolerance:
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±0.05mm (2mil)
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PCB solder mask:
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Black, white, yellow
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PCB surface finished:
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HASL Lead-free, Immersion ENIG, Chem Tin, Flash Gold, OSP, Gold finger, Peelable, Immersion Silver
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Legend:
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White
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E-test:
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100% AOI, X-ray, Flying probe test.
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Outline:
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Rout and Score/V-cut
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Inspection Standard:
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IPC-A-610CCLASSII
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Certificates:
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UL (E503048),ISO9001/ISO14001/IATF16949
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Outgoing Reports:
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Final Inspection, E-test, Solderability Test, Micro Section, and More
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