| Customization: | Available |
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| Type: | Rigid Circuit Board |
| Dielectric: | FR-4 |
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Finest Printed Circuit Board Limited is a trusted provider of high-quality PCBs and PCBAs for a wide range of consumer electronics applications. Our expertise in Electronic Manufacturing Services (EMS) allows us to deliver innovative, flexible solutions for 100W and 30W Bluetooth amplifier circuit boards. We focus on addressing the key challenges faced by our customers, such as signal integrity, power efficiency, and compact design, ensuring your amplifiers deliver superior performance.
Bluetooth amplifiers must combine compact design with high power efficiency to meet the growing demands of portable and home audio systems. Customers often face issues related to power consumption, signal distortion, and the size of the PCB when it comes to integrating Bluetooth functionality into their amplifiers. Our PCBs for 100W and 30W Bluetooth amplifiers are engineered to resolve these pain points by offering compact, high-efficiency designs that optimize power management and maintain clear audio signals.
Our amplifier PCBs ensure seamless Bluetooth connectivity while minimizing power consumption and heat generation, ideal for both compact and high-power audio devices.
Features of Our Bluetooth Amplifier PCBs:
As audio devices shrink in size and grow in complexity, manufacturers need flexible circuit designs that can fit into small, irregularly shaped enclosures. Our flexible PCBs are designed to meet these space challenges while ensuring high performance and durability. Flexible PCBs offer the advantage of being bendable, allowing for creative placement within tightly packed devices like portable Bluetooth amplifiers.
Our flexible PCBs are ideal for applications where space is at a premium and durability is essential. We combine flexibility with high electrical performance to ensure that your amplifiers meet all functionality requirements without sacrificing design integrity.
Advantages of Our Flexible PCBs:
At Finest Printed Circuit Board Limited, we understand that each customer has unique requirements. Our team provides tailored solutions that address your specific project needs, whether you're developing a high-power 100W amplifier or a more compact 30W model. From design optimization to material selection, we work with you to create customized PCBs that enhance your product's performance and reliability.
Our tailored PCB solutions are designed to address your key concerns, such as maintaining sound clarity, managing heat dissipation, and ensuring long-lasting durability in demanding consumer electronics environments.
Benefits of Our Tailored PCB Solutions:
We are committed to producing PCBs that not only perform exceptionally but also meet all relevant industry standards and regulations. Our manufacturing processes are geared towards delivering consistent, high-quality results with full compliance to safety, environmental, and performance standards. This focus on quality ensures that your Bluetooth amplifier PCBs operate reliably and safely in any consumer electronics application.
By partnering with Finest Printed Circuit Board Limited, you benefit from our stringent quality control processes and dedication to meeting global regulatory requirements.
Key Features of Our Manufacturing Process:
Finest Printed Circuit Board Limited is your go-to partner for reliable, high-performance PCBs and PCBAs designed for Bluetooth amplifiers and other consumer electronics. Whether you need a 100W amplifier for home audio systems or a 30W model for portable devices, our expertise ensures that you receive a solution that meets your exact specifications.
Get in touch with us today to request a personalized quote and explore how our innovative PCB solutions can enhance your product line and bring your ideas to market.
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PCBA Technical Capability
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1. Assembly Type::
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FR4, FPC, Rigid-flex PCB, Metal base PCB.
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2. Assembly Specification:
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Min size L50*W50mm; Max size: L510*460mm
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3. Assembly thickness:
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Min thickness: 0.2mm; Max thickness: 3.0mm
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4. Components Specification
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Components DIP:
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01005Chip/0.35 Pitch BGA
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Minimum device accuracy:
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+/-0.04mm
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Minimum footprint distance:
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0.3mm
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5. File format:
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BOM list; PCB Gerber file:
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6. Test
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IQC:
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Incoming inspection
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IPQC:
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Production inspection; first ICR test
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Visual QC:
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Regularly quality inspection
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SPI test :
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Automatic solder paste optical inspection
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AOI:
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SMD component welding detection, components shortage & component polarity detection
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X-Ravd:
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BGA test; QFN and other precision devices hidden PAD device inspection
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Function test:
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Test function and performance according to the customer's test procedures and steps
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7. Reworking:
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BGA rework equipment
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8. Delivery Time
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Normal delivery time:
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24 hours( fastest 12 hours quick-turn)
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Small production:
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72 hours( fastest 24 hours quick-turn)
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Medium production:
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5 working days.
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9. Capacity:
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SMT assembly 5 million points/day; plug-in & welding 300,000 points/day; 50-100 items/day
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10. Components Service
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A full set of substitute materials:
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Have experience in component procurement sourcing, and management systems, and provide cost-effective services for OEM projects
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Only SMT:
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Do SMT and backhand welding according to components PCB boards provided by customers.
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Components purchasing:
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Customers provide core components, and we provide component sourcing services.
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PCB Specification:
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PCB layers:
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1-24layers
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PCB materials:
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CEM1, CEM3, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free
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PCB max. board size:
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620*1100mm (Custom)
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PCB certificate:
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RoHS Directive-Compliant
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PCB Thickness:
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1.6 ±0.1mm
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Layer Copper Thickness:
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0.5-5oz
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Inner Layer Copper Thickness:
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0.5-4oz
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PCB max. board thickness:
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6.0mm
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Minimum Hole Size:
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0.20mm
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Minimum Line Width/Space:
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3/3mil
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Min. S/M Pitch:
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0.1mm(4mil)
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Plate Thickness and Aperture Ratio :
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30:1
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Minimum Hole Copper:
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20µm
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Hole Dia. Tolerance(PTH):
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±0.075mm(3mil)
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Hole dia. Tolerance(NPTH):
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±0.05mm (2mil)
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Hole Position Deviation:
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±0.05mm (2mil)
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Outline Tolerance:
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±0.05mm (2mil)
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PCB solder mask:
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Black, white, yellow
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PCB surface finished:
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HASL Lead-free, Immersion ENIG, Chem Tin, Flash Gold, OSP, Gold finger, Peelable, Immersion Silver
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Legend:
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White
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E-test:
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100% AOI, X-ray, Flying probe test.
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Outline:
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Rout and Score/V-cut
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Inspection Standard:
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IPC-A-610CCLASSII
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Certificates:
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UL (E503048),ISO9001/ISO14001/IATF16949
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Outgoing Reports:
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Final Inspection, E-test, Solderability Test, Micro Section, and More
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